Based upon practical experience, it treats the entire joining technology in the electronics production cycle as it relates to soldering--including cleaning, statistical quality control, through-hole and S M joining. Promotes an understanding of the complex interrelations of various process parameters to lead readers to an analysis and resolution of this manufacturing procedure.
By:
Armin Rahn Imprint: Wiley-Interscience Country of Publication: United States Dimensions:
Height: 231mm,
Width: 157mm,
Spine: 28mm
Weight: 658g ISBN:9780471584711 ISBN 10: 0471584711 Pages: 400 Publication Date:31 March 1993 Audience:
Professional and scholarly
,
General/trade
,
Undergraduate
Format:Hardback Publisher's Status: Active