Soldering Processes and Equipment

Michael Pecht (University of Maryland, College Park)

$295.95

Hardback

Not in-store but you can order this
How long will it take?

Availability Information

We source books from suppliers in Australia and overseas. For books we don't currently have in stock, the time it takes to get them from our suppliers can vary widely - from a few days to a few months - so we check each book with each supplier to determine the expected time it will take to be supplied to us.

We then advise you accordingly. If the time taken to get any book is too long for you, you can let us know and we will cancel or adjust your order, and refund as required.

To find out the anticipated arrival time for specific items prior to ordering, please contact us by phone or email:

Phone +61 2 9264 3111, or 1800 4 BOOKS (1800 4 26657) if outside Sydney:
option 1 Abbey's Bookshop (Crime, History, Science, Kids & more) • info@abbeys.com.au
option 2 Language Book Centre (ESL & Foreign Languages) • language@abbeys.com.au
option 3 Galaxy Bookshop (Sci-fi, Fantasy, Romance, Graphic Novels) • sf@galaxybooks.com.au

QTY:

English

Wiley-Interscience
04 June 1993

Production engineering; Engineering skills & trades; Circuits & components

Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.

Edited by: Michael Pecht (University of Maryland College Park)
Imprint: Wiley-Interscience
Country of Publication: United States
Dimensions: Height: 221mm, Width: 158mm, Spine: 23mm
Weight: 549g
ISBN: 9780471591672
ISBN 10: 047159167X
Pages: 312
Publication Date: 04 June 1993
Audience: Professional and scholarly , General/trade , Undergraduate
Format: Hardback
Publisher's Status: Active

Solders, Solder Fluxes, and Solder Pastes. Wave Soldering. Reflow Soldering. Cleaning and Contamination. Reliability and Quality. Rework, Repair, and Manual Assembly. Appendix. Glossary of Soldering Terms. Index.

Michael Pecht is a tenured faculty member with a joint appointment in Systems Research and Mechanical Engineering, and the Director of the CALCE Electronic Packaging Research Center at the University of Maryland. He has an MS in electrical engineering and an MS and PhD in engineering mechanics from the University of Wisconsin. He is a Professional Engineer and an IEEE Fellow. He serves on the board of advisors for various companies and was a West-inghouse Professor. He is the chief editor of the IEEE Transactions on Reliability, and a section editor for the Society of Automotive Engineering.