Semiconductor Microchips and Fabrication Advanced and highly illustrated guide to semiconductor manufacturing from an experienced industry insider
Semiconductor Microchips and Fabrication is a practical yet advanced book on the theory, design, and manufacturing of semiconductor microchips that describes the process using the principles of physics and chemistry, fills in the knowledge gaps for professionals and students who need to know how manufacturing equipment works, and provides valuable suggestions and solutions to many problems that students or engineers often encounter in semiconductor processing, including useful experiment results to help in process work.
The explanation of the semiconductor manufacturing process, and the equipment needed, is carried out based on the machines that are used in clean rooms over the world so readers understand how they can use the equipment to achieve their design and manufacturing ambitions. Combining theory with practice, all descriptions are carried out around the actual equipment and processes by way of a highly visual text, with illustrations including equipment pictures, manufacturing process schematics, and structures of semiconductor microchips.
Sample topics covered in Semiconductor Microchips and Fabrication include:
An introduction to basic concepts, such as impedance mismatch from plasma machines and theories, such as energy bands and Clausius-Clapeyron equation Basic knowledge used in semiconductor devices and manufacturing machines, including DC and AC circuits, electric fields, magnetic fields, resonant cavity, and the components used in the devices and machines Transistor and integrated circuits, including bipolar transistors, junction field effect transistors, and metal-semiconductor field effect transistors The main processes used in the manufacturing of microchips, including lithography, metallization, reactive-ion etching (RIE), plasma-enhanced chemical vapor deposition (PECVD), thermal oxidation and implantation, and more The skills in the design and problem solving of processes, such as how to design a dry etching recipe, and how to solve the micro-grass problems in Bosch process
Through Semiconductor Microchips and Fabrication, readers can obtain the fundamental knowledge and skills of semiconductor manufacturing, which will help them better understand and use semiconductor technology to improve their product quality or project research. Before approaching this text, readers should have basic knowledge of physics, chemistry, and circuitry.
By:
Yaguang Lian (University of Illinois USA)
Imprint: Wiley-IEEE Press
Country of Publication: United States
Dimensions:
Height: 229mm,
Width: 152mm,
Spine: 19mm
Weight: 703g
ISBN: 9781119867784
ISBN 10: 1119867789
Pages: 320
Publication Date: 30 September 2022
Audience:
Professional and scholarly
,
Undergraduate
Format: Hardback
Publisher's Status: Active
Author Biography xi Preface xiii 1 Introduction to the Basic Concepts 1 1.1 What Is a Microchip? 1 1.2 Ohm’s Law and Resistivity 1 1.3 Conductor, Insulator, and Semiconductor 5 References 5 2 Brief Introduction of Theories 7 2.1 The Birth of Quantum Mechanics 7 2.2 Energy Band (Band) 11 References 15 3 Early Radio Communication 17 3.1 Telegraph Technology 17 3.2 Electron Tube 19 References 22 4 Basic Knowledge of Electric Circuits (Circuits) 23 4.1 Electric Circuits and the Components 23 4.2 Electric Field 26 4.3 Magnetic Field 28 4.4 Alternating Current 30 5 Further Discussion of Semiconductors and Diodes 33 5.1 Semiconductor Energy Band 33 5.2 Semiconductor Doping 36 5.3 Semiconductor Diode 42 References 46 6 Transistor and Integrated Circuit 47 6.1 Bipolar Transistor 47 6.2 Junction Field Effect Transistor 49 6.3 Metal–Semiconductor Field Effect Transistor 52 6.4 Metal–Insulator–Semiconductor Field Effect Transistor 55 References 60 7 The Development History of Semiconductor Industry 61 7.1 The Instruction of Semiconductor Products and Structures 61 7.2 A Brief History of the Semiconductor Industry 63 7.3 Changes in the Size of Transistors and SiliconWafers 65 7.4 Clean Room 67 7.5 Planar Process 71 References 75 8 Semiconductor Photonic Devices 77 8.1 Light-Emitting Devices and Light-Emitting Principles 77 8.2 Light-Emitting Diode (LED) 82 8.3 Semiconductor Diode Laser 88 8.3.1 Resonant Cavity 89 8.3.2 Reflection and Refraction of Light 91 8.3.3 Heterojunction Materials 93 8.3.4 Population Inversion and Threshold Current Density 94 References 96 9 Semiconductor Light Detection and Photocell 97 9.1 Digital Camera and CCD 97 9.2 Photoconductor 100 9.3 Transistor Laser 101 9.4 Solar Cell 105 References 106 10 Manufacture of Silicon Wafer 109 10.1 From Quartzite Ore to Polysilicon 110 10.2 Chemical Reaction 113 10.3 Pull Single Crystal 115 10.4 Polishing and Slicing 116 References 123 11 Basic Knowledges of Process 125 11.1 The Structure of Integrated Circuit (IC) 125 11.2 Resolution of Optical System 128 11.3 Why Plasma Used in the Process 131 References 133 12 Photolithography (Lithography) 135 12.1 The Steps of Lithography Process 135 12.1.1 Cleaning 135 12.1.2 Dehydration Bake 136 12.1.3 Photoresist Coating 138 12.1.4 Soft Bake 141 12.1.5 Alignment and Exposure 141 12.1.6 Developing 145 12.1.7 Inspection 146 12.1.8 Hard Bake 147 12.1.9 Descum 148 12.2 Alignment Mark (Mark) Design on the Photomask 152 12.3 Contemporary Photolithography Equipment Technologies 156 References 159 13 Dielectric Films Growth 161 13.1 The Growth of Silicon Dioxide Film 162 13.1.1 Thermal Oxidation Process of SiO2 162 13.1.2 LTO Process 164 13.1.3 PECVD Process of Silicon Dioxide 166 13.1.4 TEOS + O3 Deposition Using APCVD System 167 13.2 The Growth of Silicon Nitride Film 168 13.2.1 LPCVD 168 13.2.2 PECVD Process of Silicon Nitride 171 13.3 Atomic Layer Deposition Technique 174 References 177 14 Introduction of Etching and RIE System 179 14.1 Wet Etching 179 14.2 RIE System for Dry Etching 182 14.2.1 RIE Process Flow and Equipment Structure 182 14.2.2 Process Chamber 184 14.2.3 Vacuum Pumps 186 14.2.4 RF Power Supply (Source) and Matching Network (Matchwork) 187 14.2.5 Gas Cylinder and Mass Flow Controller (MFC) 189 14.2.6 Heater and Coolant 194 References 196 15 Dry Etching 197 15.1 The Etch Profile of RIE 197 15.1.1 Case 1 198 15.1.2 Case 2 201 15.2 Etching Rate of RIE 203 15.3 Dry Etching of III–V Semiconductors and Metals 206 15.4 Etch Profile Control 207 15.4.1 Influence of the PR Opening Shape on the Etch Profile 208 15.4.2 The Effect of Carbon on Etching Rate and Profile 209 15.5 Other Issues 211 15.5.1 The Differences Between RIE and PECVD 211 15.5.2 The Difference Between Si and SiO2 Dry Etching 214 15.6 Inductively Coupled Plasma (ICP) Technique and Bosch Process 215 15.6.1 Inductively Coupled Plasma Technique 216 15.6.2 Bosch Process 219 References 223 16 Metal Processes 225 16.1 Thermal Evaporation Technique 225 16.2 Electron Beam Evaporation Technique 227 16.3 Magnetron Sputtering Deposition Technique 231 16.4 The Main Differences Between Electron Beam (Thermal) Evaporation and Sputtering Deposition 234 16.5 Metal Lift-off Process 235 16.6 Metal Selection and Annealing Technology 241 16.6.1 The Selection of Metals 241 16.6.2 Metal Annealing 242 References 243 17 Doping Processes 245 17.1 Basic Introduction of Doping 245 17.2 Basic Principles of Diffusion 246 17.3 Thermal Diffusion 247 17.4 Diffusion and Redistribution of Impurities in SiO2 248 17.5 Minimum Thickness of SiO2 Masking Film 250 17.6 The Distribution of Impurities Under the SiO2 Masking Film 251 17.7 Diffusion Impurity Sources 252 17.8 Parameters of the Diffusion Layer 255 17.9 Four-Point Probe Sheet Resistance Measurement 256 17.10 Ion Implantation Process 257 17.11 Theoretical Analysis of Ion Implantation 259 17.12 Impurity Distribution after Implantation 260 17.13 Type and Dose of Implanted Impurities 262 17.14 The Minimum Thickness of Masking Film 263 17.15 Annealing Process 264 17.16 Buried Implantation 266 17.16.1 Implantation through Masking Film 266 17.16.2 SOI Manufacture 267 References 270 18 Process Control Monitor, Packaging, and the Others 271 18.1 Dielectric Film Quality Inspection 271 18.2 Ohmic Contact Test 273 18.3 Metal-to-Metal Contact 274 18.4 Conductive Channel Control 277 18.5 Chip Testing 278 18.6 Dicing 279 18.7 Packaging 280 18.8 Equipment Operation Range 281 18.9 Low-k and High-k Dielectrics 282 18.9.1 Copper Interconnection and Low-k Dielectrics 283 18.9.2 Quantum Tunneling Effect and High-k Dielectrics 286 18.10 End 291 References 293 Index 295
Mr. Yaguang Lian is a Research Engineer at Holonyak Micro & Nanotechnology Lab, the University of Illinois, USA. In his twenty years of working, he has trained thousands of students in using the manufacturing machines. Before Mr. Lian came to the USA, he worked at the Hebei Semiconductor Research Institute (HSRI), China, for over 13 years. At HSRI, he oversaw the entire manufacturing process line, from implantation to packaging, in addition to IC design work. Working in the field of semiconductors for over 30 years, Mr. Lian deeply understands the key points of the manufacturing process and has a profound knowledge on both theory and equipment.
