Self-Organized 3D Integrated Optical Interconnects: with All-Photolithographic Heterogeneous Integration...

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Tetsuzo Yoshimura

Self-Organized 3D Integrated Optical Interconnects

with All-Photolithographic Heterogeneous Integration

Tetsuzo Yoshimura

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Hardback

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English

Jenny Stanford Publishing
09 March 2021

Light (optics); Electrical engineering; Microwave technology; Environmental science, engineering & technology; Laser technology & holography

Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules.

This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.

By: Tetsuzo Yoshimura
Imprint: Jenny Stanford Publishing
Country of Publication: Singapore
Dimensions: Height: 229mm, Width: 152mm,
Weight: 839g
ISBN: 9789814877046
ISBN 10: 9814877042
Pages: 380
Publication Date: 09 March 2021
Audience: Professional and scholarly , Undergraduate
Format: Hardback
Publisher's Status: Active

Tetsuzo Yoshimura is currently a professor emeritus at Tokyo University of Technology.

Reviews for Self-Organized 3D Integrated Optical Interconnects: with All-Photolithographic Heterogeneous Integration

The book describes 3D optical interconnects intended for high-performance chip and board-level communications. In the first three chapters, it presents the fundamentals and challenges of optical interconnection and the strategies for scaling at the chip and module level. It then covers, in three chapters, the fundamentals of heterogeneous integrated photonics technologies pioneered by the author's research. The final three chapters, in a hundred pages, treat self-organized lightwave networks-or SOLNET-and develop in detail the technologies for fabrication of the interconnect along with modeling, computer simulation of the performances and experimental validation. The book is stimulating for a variety of readers-scientists, engineers and students-and will be a useful reference for further research and development in the nascent field of optical interconnections. Silvano Donati, University of Pavia, Italy