Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect...

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Jie Cheng

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

Jie Cheng

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English

Springer Verlag, Singapore
30 January 2019

Surface-coating technology; Tribology (friction & lubrication); Materials science; Production engineering; Electronics engineering

Series: Springer Theses

This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.

By: Jie Cheng
Imprint: Springer Verlag, Singapore
Country of Publication: Singapore
Edition: Softcover reprint of the original 1st ed. 2018
Dimensions: Height: 235mm, Width: 155mm,
Weight: 454g
ISBN: 9789811355851
ISBN 10: 9811355851
Series: Springer Theses
Pages: 137
Publication Date: 30 January 2019
Audience: Professional and scholarly , Undergraduate
Format: Paperback
Publisher's Status: Active

Introduction.- Material Removal Mechanism of Cu in KIO4-based Slurry.- Material Removal Mechanism of Ru in KIO4-based Slurry.- Tribocorrosion Investigations of Cu/Ru Interconnect Structure during CMP.- Micro-galvanic Corrosion of Cu/Ru Couple in KIO4 Solution.- Galvanic Corrosion Inhibitors for Cu/Ru Couple During Chemical Mechanical Polishing of Ru.- Synergetic Effect of Potassium Molybdate and Benzotriazole on the CMP of Ru and Cu in KIO4-based Slurry.- Conclusions and Recommendations.