Lead Free Solder

Mechanics and Reliability

John Hock Lye Pang

$260.95 $208.95

Hardback

Not in-store but you can order this
How long will it take?

Availability Information

We source books from suppliers in Australia and overseas. For books we don't currently have in stock, the time it takes to get them from our suppliers can vary widely - from a few days to a few months - so we check each book with each supplier to determine the expected time it will take to be supplied to us.

We then advise you accordingly. If the time taken to get any book is too long for you, you can let us know and we will cancel or adjust your order, and refund as required.

To find out the anticipated arrival time for specific items prior to ordering, please contact us by phone or email:

Phone +61 2 9264 3111, or 1800 4 BOOKS (1800 4 26657) if outside Sydney:
option 1 Abbey's Bookshop (Crime, History, Science, Kids & more) • info@abbeys.com.au
option 2 Language Book Centre (ESL & Foreign Languages) • language@abbeys.com.au
option 3 Galaxy Bookshop (Sci-fi, Fantasy, Romance, Graphic Novels) • sf@galaxybooks.com.au

QTY:

English

Springer-Verlag New York Inc.
14 October 2011

Stress & fracture; Circuits & components; Semi-conductors & super-conductors

Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.

By: John Hock Lye Pang
Imprint: Springer-Verlag New York Inc.
Country of Publication: United States
Edition: 2012
Dimensions: Height: 235mm, Width: 155mm, Spine: 12mm
Weight: 454g
ISBN: 9781461404620
ISBN 10: 1461404622
Pages: 175
Publication Date: 14 October 2011
Audience: Professional and scholarly , Undergraduate
Format: Hardback
Publisher's Status: Active

Introduction.- Theory on Mechanics of Solder Materials.-Mechanical Properties and Constitutive Models.- Fatigue Life Prediction Models.- Finite Element Analysis and Design-For-Reliability.- Thermo-Mechanical Reliability Test and Analysis.- Dynamic Mechanical Reliability Test and Analysis.- Thermal Cycling Aging Effects on Board-Level Drop Test Result