LCP for Microwave Packages and Modules

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Anh-Vu H. Pham (University of California, Davis) Morgan J. Chen (Staff RF Engineer)

LCP for Microwave Packages and Modules

Anh-Vu H. Pham (University of California, Davis), Morgan J. Chen (Staff RF Engineer), Kunia Aihara

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English

Cambridge University Press
21 June 2012

Electronics & communications engineering; Electronics engineering; Communications engineering & telecommunications; Telephone technology; Television technology

Series: The Cambridge RF and Microwave Engineering Series

A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering.

By: Anh-Vu H. Pham (University of California Davis), Morgan J. Chen (Staff RF Engineer), Kunia Aihara
Imprint: Cambridge University Press
Country of Publication: United Kingdom
Dimensions: Height: 253mm, Width: 176mm, Spine: 16mm
Weight: 680g
ISBN: 9781107003781
ISBN 10: 1107003784
Series: The Cambridge RF and Microwave Engineering Series
Pages: 266
Publication Date: 21 June 2012
Audience: Professional and scholarly , Undergraduate
Format: Hardback
Publisher's Status: Active

Anh-Vu H. Pham is a Professor at the University of California, Davis, where he leads the Microwave Microsystems Lab. He has published around 100 peer-reviewed papers, several book chapters and one book, is currently the Vice Chair of IEEE International Microwave Symposium Technical Committee on Power Amplifiers and Integrated Devices and a Microwave Distinguished Lecturer of the IEEE MTT for the term 2010–2012. Morgan J. Chen is a Staff Engineer at FutureWei Technologies, an R&D US subsidiary of Huawei Technologies. He has worked in both academia and industry for over a decade, advancing high-frequency packaging from DC to past 60 GHz. Kunia Aihara is an Electronics Engineer in the RF/EO Subsystems branch of the Air Force Research Laboratory.

Reviews for LCP for Microwave Packages and Modules

Advance praise: 'These foremost experts have created a compendium on microwave and millimeter-wave applications of LCP in packaging and modules that is clear and comprehensive, starting with materials science and theory, going through wide-ranging and current practical applications, and even covering all of the practical reliability aspects. Moreover, they have revealed in detail a host of design tricks (such as defected grounds) and advanced circuitry (such as a folded Marchand balun with a broadband even-mode matching network) that can enhance the designer's arsenal in general. We have here a valuable text for microwave designers at all levels.' Ed Stoneham, Stoneham Innovations