Instant Bonding Epoxy Technology is a comprehensive guide on the chemistry, formulation, and applications of epoxy adhesive technology, focusing on instant bonding innovations. Authored by a leading expert in polymer science, the book explores the latest advancements across UV, thermal, hybrid, and ambient curing technologies. Structured into six chapters, it begins with the fundamentals of epoxy resins, curing agents, and adhesive formulations. Subsequent chapters cover UV cure cationic epoxy chemistry, dual cure hybrid systems combining UV and thermal processes, and snap thermal cure adhesives leveraging latent curing agents. Advanced topics include induction cure epoxy technology with laser and weld bonding applications, as well as snap ambient cure systems for room-temperature bonding.
By:
Chunfu Chen Imprint: Bentham Science Publishers Singapore Pte. Ltd. Country of Publication: Singapore Dimensions:
Height: 254mm,
Width: 178mm,
Spine: 14mm
Weight: 522g ISBN:9789815313468 ISBN 10: 9815313460 Pages: 214 Publication Date:21 March 2025 Audience:
General/trade
,
ELT Advanced
Format:Paperback Publisher's Status: Active