This book gathers selected papers presented at the 1st International Conference on Industrial Applications of Adhesives 2020 (IAA 2020). It covers a wide range of topics, including adhesive curing for electronic and automotive industries; adhesive testing with a torsion machine for rigorous mechanical properties determination; joint design using innovative techniques such as the meshless method; design methodologies in the automotive industry for joints under impact; temperature effects in joints typically found in civil engineering; and advanced nondestructive techniques such as terahertz spectroscopy to assess the durability of adhesive joints. Providing a review of the state-of the art in industrial applications of adhesives, the book serves as a valuable reference resource for researchers and graduate students interested in adhesive bonding.
Edited by:
Lucas F. M. da Silva, Robert D. Adams, Chiaki Sato, Klaus Dilger Imprint: Springer Verlag, Singapore Country of Publication: Singapore Edition: 2021 ed. Dimensions:
Height: 235mm,
Width: 155mm,
Weight: 238g ISBN:9789811567698 ISBN 10: 9811567697 Series:Lecture Notes in Mechanical Engineering Pages: 138 Publication Date:24 July 2021 Audience:
Professional and scholarly
,
Undergraduate
Format:Paperback Publisher's Status: Active