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Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 3: Compact Thermal Models Of Electronic Components by Mohammed-nabil Sabry (Mansoura Univ, Egypt) at Abbey's Bookshop,
Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 3: Compact Thermal Models Of...
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Mohammed-nabil Sabry (Mansoura Univ, Egypt) Clemens Lasance (Philips Research Lab, Emeritus, The Netherlands)

Encyclopedia Of Thermal Packaging, Set 2

Thermal Packaging Tools - Volume 3: Compact Thermal Models Of Electronic Components

Mohammed-nabil Sabry (Mansoura Univ, Egypt),  Clemens Lasance (Philips Research Lab, Emeritus, The Netherlands),  Avram Bar-cohen (Univ Of Maryland, Usa)

$1278.95   $1023.36

Hardback

Not in-store but you can order this
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English
World Scientific Publishing Co Pte Ltd
18 December 2014
Mechanical engineering & materials
Series: Encyclopedia Of Thermal Packaging
The second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order ""compact"" thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve ""correct by design"" thermal packaging solutions. The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ""learning curve,"" the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
By:   , , ,
Editor-in-chief:  
Imprint:   World Scientific Publishing Co Pte Ltd
Country of Publication:   Singapore
Volume:   2
ISBN:   9789814313841
ISBN 10:   981431384X
Series:   Encyclopedia Of Thermal Packaging
Pages:   436
Publication Date:  
Audience:   College/higher education ,  Professional and scholarly ,  Primary ,  Undergraduate
Format:   Hardback
Publisher's Status:   Active

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