Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 1: Cooling Of Microelectronic...

— —

Madhusudan Iyengar (Google, Usa) Karl J L Geisler (3m, Usa)

Encyclopedia Of Thermal Packaging, Set 2

Thermal Packaging Tools - Volume 1: Cooling Of Microelectronic And Nanoelectronic Equipment:...

Madhusudan Iyengar (Google, Usa), Karl J L Geisler (3m, Usa), Bahgat G Sammakia (Suny-binghamton Univ, Usa)

$1204.95 $964.32

Hardback

Not in-store but you can order this
How long will it take?

Availability Information

We source books from suppliers in Australia and overseas. For books we don't currently have in stock, the time it takes to get them from our suppliers can vary widely - from a few days to a few months - so we check each book with each supplier to determine the expected time it will take to be supplied to us.

We then advise you accordingly. If the time taken to get any book is too long for you, you can let us know and we will cancel or adjust your order, and refund as required.

To find out the anticipated arrival time for specific items prior to ordering, please contact us by phone or email:

Phone +61 2 9264 3111, or 1800 4 BOOKS (1800 4 26657) if outside Sydney:
option 1 Abbey's Bookshop (Crime, History, Science, Kids & more) • info@abbeys.com.au
option 2 Language Book Centre (ESL & Foreign Languages) • language@abbeys.com.au
option 3 Galaxy Bookshop (Sci-fi, Fantasy, Romance, Graphic Novels) • sf@galaxybooks.com.au

QTY:

English

World Scientific Publishing Co Pte Ltd
18 December 2014

Mechanical engineering & materials

Series: Encyclopedia Of Thermal Packaging

Summary
Details

The second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order ""compact"" thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve ""correct by design"" thermal packaging solutions. The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ""learning curve,"" the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

Edited by: Madhusudan Iyengar (Google Usa), Karl J L Geisler (3m, Usa), Bahgat G Sammakia (Suny-binghamton Univ, Usa)
Imprint: World Scientific Publishing Co Pte Ltd
Country of Publication: Singapore
Volume: 2
ISBN: 9789814327633
ISBN 10: 9814327638
Series: Encyclopedia Of Thermal Packaging
Pages: 432
Publication Date: 18 December 2014
Audience: College/higher education , Professional and scholarly , Primary , Undergraduate
Format: Hardback
Publisher's Status: Active

PRIZES to win! PROMOTIONS

Encyclopedia Of Thermal Packaging, Set 2

Thermal Packaging Tools - Volume 1: Cooling Of Microelectronic And Nanoelectronic Equipment:...

Madhusudan Iyengar (Google, Usa), Karl J L Geisler (3m, Usa), Bahgat G Sammakia (Suny-binghamton Univ, Usa)

$1204.95 $964.32

Hardback

See Also

Contact Abbeys

Contact Galaxy

Contact Language

Contact Us

About ABBEY'S