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DNA Damage Recognition

Wolfram Siede Paul W. Doetsch



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CRC Press
18 October 2019
Stands as the most comprehensive guide to the subject-covering every essential topic related to DNA damage identification and repair.

Covering a wide array of topics from bacteria to human cells, this book summarizes recent developments in DNA damage repair and recognition while providing timely reviews on the molecular mechanisms employed by cells to distinguish between damaged and undamaged sites and stimulate the appropriate repair pathways.

about the editors...

WOLFRAM SIEDE is Associate Professor, Department of Cell Biology and Genetics, University of North Texas Health Science Center, Fort Worth. He received the Ph.

D. degree (1986) from Johann Wolfgang Goethe University, Frankfurt Germany.

YOKE WAH KOW is Professor, Department of Radiation Oncology, Emory University School of Medicine, Atlanta, Georgia. He received the Ph.

D. degree (1981) from Brandeis University, Waltham, Massachusetts.

PAUL W. DOETSCH is Professor, Departments of Biochemistry, Radiation Oncology, and Hematology and Oncology, and Associate Director for Basic Research, Winship Cancer Institute, Emory University School of Medicine, Atlanta, Georgia. He received the Ph.

D. degree (1982) from Temple University School of Medicine, Philadelphia, Pennsylvania.
Edited by:   Wolfram Siede, Paul W. Doetsch
Imprint:   CRC Press
Country of Publication:   United Kingdom
Dimensions:   Height: 254mm,  Width: 178mm, 
Weight:   1.656kg
ISBN:   9780367392130
ISBN 10:   0367392135
Pages:   872
Publication Date:   18 October 2019
Audience:   College/higher education ,  Professional and scholarly ,  Primary ,  Undergraduate
Format:   Paperback
Publisher's Status:   Active
Mechanisms of Damage Recognition: Theoretical Considerations. UV Damage and Other Bulky DNA-adducts. Non-bulky Base Damage. Mismatch Repair. Replicational Bypass of DNA Lesions. DNA Strand Breaks. Perception of DNA Damage for Initiating Regulatory Responses

Wolfram Siede, Yoke Wah Kow, Paul W. Doetsch

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