Handbook for Cleaning for Semiconductor Manufacturing: Fundamentals and Applications

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Karen A. Reinhardt Richard F. Reidy

Handbook for Cleaning for Semiconductor Manufacturing

Fundamentals and Applications

Karen A. Reinhardt, Richard F. Reidy

$527.95

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English

Wiley-Scrivener
20 December 2010

Precision instruments manufacture; Mechanical engineering & materials; Electronics & communications engineering; Semi-conductors & super-conductors

Series: Wiley-Scrivener

Provides an In-depth discussion of surface conditioning for semiconductor applications

The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications provides an in-depth discussion of surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet processing is reviewed as well as surface and colloidal aspects of cleaning and etching.

Topics covered in this new reference include:

Front end line (FEOL) and back end of line (BEOL) cleaning applications such as high-k/metal gate post-etch cleaning and pore sealing, high-dose implant stripping and cleaning, and germanium, and silicon passivation Formulation development practices, methodology and a new directions are presented including chemicals used for preventing corrosion of copper lines, cleaning aluminium lines, reclaiming wafers, and water bonding, as well as the filtering and recirculating of chemicals including reuse and recycling Wetting, cleaning, and drying of features, such as high aspect ratio features and hydrophilic surface states, especially how to dry without watermarks, the abilities to wet hydrophobic surfaces and to remove liquid from deep features The chemical reactions and mechanisms of silicon dioxide etching with hydrofluoric acid, particle removal with ammonium hydroxide/hydrogen peroxide mixture, and metal removal with hydrochloric acid

The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications is a valuable resource for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing. Engineers working for semiconductor manufacturing, capital equipment, chemicals, or other industries that assures cleanliness of chemicals, material, and equipment in the manufacturing area will also find this handbook an indispensible reference.

Edited by: Karen A. Reinhardt, Richard F. Reidy
Imprint: Wiley-Scrivener
Country of Publication: United States
Dimensions: Height: 262mm, Width: 185mm, Spine: 34mm
Weight: 1.202kg
ISBN: 9780470625958
ISBN 10: 0470625953
Series: Wiley-Scrivener
Pages: 614
Publication Date: 20 December 2010
Audience: Professional and scholarly , Undergraduate
Format: Hardback
Publisher's Status: Active

Karen A. Reinhardt is Principle Consultant at Cameo Consulting in San Jose, California. Currently, Karen works with start-up cleaning companies to develop their technology for acquisition. Prior to forming a consulting company, Karen was employed at Novellus Systems, AMD, and Cypress Semiconductor. She has published more than 30 technical publications, has been awarded seven patents, and is co-editor of Handbook of Silicon Wafer Cleaning Technology. Richard F. Reidy (Ph.D., Penn State) is interim Chair and associate professor of Material Science and Engineering at the University of North Texas. He has conducted research in interconnect processing and characterization with over 60 technical publications and three patents. He is a member of the International Technology Roadmap for Semiconductors.