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Characterization of Minerals, Metals, and Materials 2022

Mingming Zhang Jian Li Bowen Li Sergio Neves Monteiro

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English
Springer Nature Switzerland AG
04 February 2023
The collection focuses on the advancements of characterization of minerals, metals, and materials and the applications of characterization results on the processing of these materials. Advanced characterization methods, techniques, and new instruments are emphasized. Areas of interest include, but are not limited to:

• Novel methods and techniques for characterizing materials across a spectrum of systems and processes.

• Characterization of mechanical, thermal, electrical, optical, dielectric, magnetic, physical, and other properties of materials.

• Characterization of structural, morphological, and topographical natures of materials at micro- and nano- scales.

• Characterization of extraction and processing including process development and analysis.

• Advances in instrument developments for microstructure analysis and performance evaluation of materials, such as computer tomography (CT), X-ray and neutron diffraction, electron microscopy (SEM,FIB, TEM), and spectroscopy (EDS, WDS, EBSD) techniques.

• 2D and 3D modelling for materials characterization.
Edited by:   , , , ,
Imprint:   Springer Nature Switzerland AG
Country of Publication:   Switzerland
Edition:   2022 ed.
Dimensions:   Height: 235mm,  Width: 155mm, 
Weight:   777g
ISBN:   9783030923754
ISBN 10:   3030923754
Series:   The Minerals, Metals & Materials Series
Pages:   488
Publication Date:  
Audience:   Professional and scholarly ,  Undergraduate
Format:   Paperback
Publisher's Status:   Active

Mingming Zhang, Wood Mackenzie; Jian Li, CanmetMATERIALS; Bowen Li, Michigan Technological University; Sergio N. Monteiro, Instituto Militar de Engenharia; Shadia Ikhmayies, Al Isra University; Yunus Eren Kalay, Middle East Technical University; Jiann-Yang Hwang, Michigan Technological University; Juan P. Escobedo-Diaz, University of New South Wales; John S. Carpenter, Los Alamos National Laboratory; Andrew D. Brown, DEVCOM U.S. Army Research Laboratory; Rajiv Soman, Eurofins EAG Materials Science LLC

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