Flexible Electronic Packaging and Encapsulation Technology

Hong Meng (Peking University), Wei Huang (Northwestern Polytechnical University)

$276.95

Hardback

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English

Blackwell Verlag GmbH
24 April 2024

Materials science; Electronics engineering

Flexible Electronic Packaging and Encapsulation Technology

A systematic introduction to the future of electronic packaging

Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential.

Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems.

Flexible Electronic Packaging and Encapsulation Technology readers will also find:

Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field

Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.

Edited by: Hong Meng (Peking University), Wei Huang (Northwestern Polytechnical University)
Imprint: Blackwell Verlag GmbH
Country of Publication: Germany
Dimensions: Height: 244mm, Width: 170mm, Spine: 26mm
Weight: 879g
ISBN: 9783527353590
ISBN 10: 3527353593
Pages: 384
Publication Date: 24 April 2024
Audience: Professional and scholarly , Undergraduate
Format: Hardback
Publisher's Status: Active

Hong Meng, PhD, is Professor in the School of Advanced Materials at Peking University Shenzhen Graduate School, China. He has been working in the field of organic electronics for more than 30 years, including working at the Instute of Materials Science and Engineering (IMRE) in Singapore, Lucent Technologies Bell Labs, and DuPont Experimental Station. Wei Huang, PhD, is Professor at Frontiers Science Center for Flexible Electronics, Institute of Flexible Electronics, Northwestern Polytechnical University, China. He is Academician of Chinese Academy of Sciences, Russian Academy of Sciences, International Member of the National Academy of Engineering of USA, Academy of Engineering and Technology, Asian Pacific Academy of Materials, and Pakistan Academy of Sciences. He is an eminent scientist in the area of organic optoelectronics and flexible electronics.

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Flexible Electronic Packaging and Encapsulation Technology

Hong Meng (Peking University), Wei Huang (Northwestern Polytechnical University)

$276.95

Hardback

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