Microelectronic Packaging

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M. Datta (Cooligy, Inc., Mountain View, California, USA Cooligy, Inc., Mountain View, California, USA) Tetsuya Osaka (University of Tokyo, Japan)

Microelectronic Packaging

M. Datta (Cooligy, Inc., Mountain View, California, USA Cooligy, Inc., Mountain View, California, USA), Tetsuya Osaka (University of Tokyo, Japan), J. Walter Schultze (Heinrich Heine Universit¿t, D¿sseldorf, Germany) , Tetsuya Osaka (University of Tokyo, Japan)

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English

CRC Press
20 December 2004

Electrochemistry & magnetochemistry; Electronics engineering

Series: New Trends in Electrochemical Technology

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.

Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including

the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and

multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools

in enabling technology development, the book concludes with

chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools.

Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.

Contributions by: Sol Krongelb
Edited by: M. Datta (Cooligy Inc. Mountain View California USA Cooligy Inc. Mountain View California USA), Tetsuya Osaka (University of Tokyo, Japan), J. Walter Schultze (Heinrich Heine Universit¿t, D¿sseldorf, Germany), Tetsuya Osaka (University of Tokyo, Japan)
Imprint: CRC Press
Country of Publication: United Kingdom
Dimensions: Height: 234mm, Width: 156mm, Spine: 30mm
Weight: 907g
ISBN: 9780415311908
ISBN 10: 041531190X
Series: New Trends in Electrochemical Technology
Pages: 564
Publication Date: 20 December 2004
Audience: College/higher education , Professional and scholarly , Primary , Undergraduate
Format: Hardback
Publisher's Status: Active

Introduction. Chip metallization. Chip-package interconnect. Packages and PC boards. Processing tools.

M. Datta, Tetsuya Osaka, J. Walter Schultze